Job Description

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products. To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for over five decades. Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth.

Disaggregation Manufacturing Organization (DMO) is responsible for enabling and ramping modular manufacturing, which is a critical capability for Intel's leadership products. The project will include 2 types of factories: Advanced Packaging and Bump/Interposer with Group Leader positions open in the Wafer Level Assembly, C4 Bump, and Interposer Wafer Processing areas. The Engineering Group Leader will report to the Photolithography Department Manager. The candidate should have expertise in Photolithography processes, DUV Scanner Exposure System and Reticle Management.

Responsibility will include, but are not limited to: Set priorities for the team, get results across boundaries, ensure an inclusive work environment, develop employees, and manage performance. Plans, provides resources for directs activities in engineering function to meet schedules, standards, and cost. Cultivates and reinforces appropriate group values, norms and behaviors. Identifies and analyzes problems, plans, tasks, and solutions. Provides guidance on employee development, performance, and productivity issues. Plans and schedules daily tasks, uses judgement on a variety of problems requiring deviation from standard practices. Establish tactical plans to ensure meeting equipment and process qualifications on the required timeline. Drive operational expertise and excellence across all modules of the organization with strict adherence to Factory/Department standards.

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to minimum requirements and are considered a plus factor in identifying top candidates. BS in Chemical/Materials/Mechanical/Mechatronic/Electrical Engineering, Physics or equivalent with 6+ years industry experiences in semiconductor field. MS in Chemical/Materials/Mechanical/Mechatronic/ Electrical Engineering, Physics or equivalent with 4+ years industry experiences in semiconductor field. PhD in Chemical/Materials/Mechanical/Mechatronic/Electrical Engineering, Physics or equivalent with 2+ years industry experiences in semiconductor field.

Preferred Qualifications: 10+ years experience in Photolithography Scanner equipment and processes. 5+ years experience with module supervisory and/or management experience in a High-Volume Manufacturing in semiconductor field. The ideal candidate should exhibit the following behavioral traits: Must be a self-starter, highly organized, and have an ability to work independently across organizations. Understand of semiconductor process flow technology and theory of constraint management. Experience in semiconductor industry related environment in Photolithography Scanner, Track and Reticle Management. Strong technical/ engineering background in wafer fabrication. Proven track record in technical problem solving and able to provide solution to overcome complex technical challenges. Excellent communication skills with a high tolerance for ambiguous and dynamic situations. Ability to coordinate, lead and develop teams (improvement, preventive, corrective and sustaining). People interactive skills with all organization levels in a diverse environment.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)

Working Model

This role will require an on-site presence.